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E-BOOK
Author Jin, Yufeng.
Title Introduction to microsystem packaging technology / Yufeng Jin, Zhiping Wang, Jing Chen.
Imprint Boca Raton, FL : CRC Press/Taylor & Francis, ©2011.

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Description 1 online resource (xiii, 218 pages) : illustrations
Bibliog. Includes bibliographical references and index.
Note Available only to authorized UTEP users.
Print version record.
Subject Microelectronic packaging.
Genre Electronic books.
Contents Ch. 1. Introduction -- ch. 2. Design technique for microsystems packaging and integration -- ch. 3. Substrate technology -- ch. 4. Interconnection technology -- ch. 5. Device-level packaging -- ch. 6. MEMS packaging -- ch. 7. Module assembly and optoelectronic packaging -- ch. 8. System-level packaging technology -- ch. 9. Reliability -- ch. 10. Prospects for microsystems packaging technology.
Summary The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process-including design and manufacturing technologies-is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics.
Other Author Wang, Zhiping, 1962 October 6-
Chen, Jing, 1974-
Other Title Print version: Jin, Yufeng. Introduction to microsystem packaging technology. Boca Raton, FL : CRC Press/Taylor & Francis, ©2011 9781439819104