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E-BOOK
Title Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore
Imprint San Diego : Elsevier Science & Technology, 2019.

Copies/Volumes

LOCATION CALL # STATUS
 Internet  Electronic Book    AVAILABLE
Description 1 online resource (436 pages)
Series Woodhead Publishing Series in Electronic and Optical Materials Ser.
Woodhead Publishing Series in Electronic and Optical Materials Ser.
Note Available only to authorized UTEP users.
Print version record.
Other Author Che, Faxing.
Lin, Tingyu.
Jin, Cheng.
Other Title Print version: Zhao, Wensheng. Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore. San Diego : Elsevier Science & Technology, ©2019 9780081025321