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E-BOOK
Title Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao.
Imprint Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier, [2020]

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Description 1 online resource.
Series Woodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials.
Woodhead Publishing series in electronic and optical materials.
Series on advanced electronic packaging technology and key materials.
Bibliog. Includes bibliographical references and index.
Note Available only to authorized UTEP users.
Description based on online resource; title from digital title page (viewed on February 4, 2020).
Subject Electronic apparatus and appliances -- Packaging.
Other Author Che, Faxing, author.
Lin, Tingyu, author.
Zhao, Wensheng, author.
Other Title Print version: Zhang, Hengyun. Modeling, analysis, design, and tests for electronics packaging beyond Moore 0081025327 9780081025321