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Title Integrated lasers on silicon / Charles Cornet, Yoan Léger, Cédric Robert.
Imprint [London] : ISTE Press, Ltd. ; Kidlington, Oxford : Elsevier, 2016.


 Internet  Electronic Book    AVAILABLE
 Internet  Electronic Book    AVAILABLE
Description 1 online resource
Series Advances lasers set
Advances lasers set (ISTE Press (Firm))
Bibliog. Includes bibliographical references and index.
Note Available only to authorized UTEP users.
Online resource; title from PDF title page (ScienceDirect, viewed Aug. 1, 2016).
Subject Silicon -- Effect of lasers on.
Genre Electronic books.
Contents Front Cover ; Integrated Lasers on Silicon; Copyright ; Contents; Preface; Introduction; Chapter 1: Laser Integration Challenges; 1.1. Evolution of microprocessor technologies; 1.2. Photonic integration schemes; 1.3. Semiconductor lasers; Chapter 2: Group IV Silicon Lasers; 2.1. Group IV silicon lasers: issues; 2.2. Emission from bulk silicon; 2.3. Using quantum confinement; 2.4. Raman scattering for lasing; 2.5. Rare-earth doping; 2.6. Group IV SiGeSn alloys for lasing; Chapter 3: III-V Lasers Bonded on Si; 3.1. Introduction.
3.2. Historical flip-chip bonding technology: advantages and drawbacks3.3. Die versus wafer bonding; 3.4. Basic principles of wafer bonding; 3.5. Basic principles of transfer printing ; 3.6. Device structures and performances of III-V lasers coupled to SOI waveguides; 3.7. Conclusion; Chapter 4: Monolithic III-V Lasers on Silicon; 4.1. The monolithic integration: issues and strategies; 4.2. Monolithic devices; Chapter 5: Laser Architectures for On-chip Information Technologies; 5.1. The role of integrated lasers in hybrid photonic- electronic chips; 5.2. Laser designs for on-chip routing.
5.3. Concluding remarksConclusion; Bibliography; Index; Back Cover.
Summary Integrated Lasers on Silicon provides a comprehensive overview of the state-of-the-art use of lasers on silicon for photonic integration. The authors demonstrate the need for efficient laser sources on silicon, motivated by the development of on-board/on-chip optical interconnects and the different integration schemes available. The authors include detailed descriptions of Group IV-based lasers, followed by a presentation of the results obtained through the bonding approach (hybrid III-V lasers). The monolithic integration of III-V semiconductor lasers are explored, concluding with a discussion of the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment. Features a clear description of the advantages, drawbacks, and challenges of laser integration on silicon Serves as a staple reference in the general field of silicon photonics Focuses on the promising developments of hybrid and monolithic III-V lasers on silicon, previously unreviewed Discusses the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment.
Other Author Léger, Yoan, author.
Robert, Cedric, author.
Other Title Print version: 1785480626 9781785480621